Manufacturer: Advantest
Applicable Product: Logic, SoC, RF
Models: PS1600, EXA Scale

It provides a high-speed, multi-channel, multi-functional, and highly scalable standard shared platform without the need to change test models frequently. All can be integrated into this platform for test production, whether logic signals, mixed signals, analog signals, or even radio frequency signals. Furthermore, the modular design of the device does not increase the equipment platform area after integration.

Smart Scale works with Smart7 and Smart8 operating systems. 

The new V93000 EXA Scale™ SoC test system is suitable for high-end digital ICs up to exascale performance levels. The system’s new test head features Xtreme Link™ technology and EXA Scale universal digital and power cards to enable new test methods.

Manufacturer: Advantest
Applicable Product: Logic, SoC
Models: T2000 LS and T2000EPP

In the current era of rapid product development and change, SoC components demand is generally in smaller volumes with more variety.

At the same time, the packaging products are highly integrated with processing methods, allowing the same integrated circuit to have more functions. Furthermore, chip product designers need to work harder to develop and replace test functions in short intervals.

The T2000 series can quickly provide the test conditions requested by customers. They can complete rapid design, production, manufacturing, testing and provide high-speed product testing and high-cost performance to meet customer needs. 

Manufacturer: Teradyne
Applicable Product: Logic, SoC, RF
Model: UltraFLEX-SC, UltraFLEX-HD, Uflex-Plus

It adopts standardized system interface designs to provide flexible test board application and convenient scalability.

It is a popular SoC test system in the industry, supporting the test requirements of logic signals, mixed signals, analog signals, and radio frequency signals.

UltraFLEX plus improves parallel testing efficiency by increasing the number of stations and reducing multi-station testing time to meet testing needs. A new test interface board (DIB) architecture improves the accuracy and consistency of critical measurements. The innovative PACE™ operating architecture and multi-core system controller can maintain board efficiency and coordinate work to increase system productivity. Broadside™ Application Interface Compared with traditional ATE, the Broadside DIB structure rotates the board 90 degrees from the original structure, which means that each workstation can obtain a corresponding signal transmission path.

Manufacturer: COHU
Applicable Product: Logic, SoC, RF, LCD Driver
Model: DX

The large-scale test system is reduced to desktop size to meet the needs of design centers and engineering laboratories and can provide general standard ATE functions.

The size saves and reduces the space requirements of the design center, including decreasing the need for electricity, gas, and other requirements, allowing designers to facilitate operation and verification while still providing high-pin-count integrated circuit testing.

It also supports logic signals, mixed signals, analog signals, and RF signal test requirements. 

Manufacturer: Teradyne
Applicable Product: Logic, MCU
Models: J750Ex, J750HD 

This system is widely used in various microcontrollers, FPGAs, and digital audio/baseband products for economical and efficient testing, and provides a complete set of wafer classification and final testing production interface solutions.