TPW's requirements not only exceed customer expectations but are also far stricter than industry standards. We uphold the industry's most rigorous automotive device standards and automotive-grade quality to achieve stability, higher yield, and the best probe card installation for wafer testing.
Die testing is the process of inspecting the quality of crystal grain (die) on wafers by needle testing according to the designed electrical standard specifications; because it is a wafer-level test, it is also called a wafer test.
TPW has various wafer test platforms and sufficient production capacity to support the mass production needs of customers' products at any time.
Wafer testing tests the electrical functions of each die on the chips, and unqualified die will be marked and eliminated.
TPW provides a wide range of test environments and platforms for wafer testing (the wafer size capacity is 8 inches and 12 inches). The test temperature range also provides ultra-high and ultra-low temperature (55 degrees Celsius to 150 degrees Celsius) services
In terms of automotive device standards, any errors may cause major accidents and severe loss of life and property. TPW has been certified by many global first-class automotive suppliers and end customers, and our requirements for automotive-grade quality far exceed industry standards.
Testing also plays a vital role for memory chips, which is to calculate the repair coordinates of the die through a globally consistent measurement standard (CIPM MRA) and repair the wafer test's repairable die with lasers to improve yield and reliability
TPW uses probe cards, which have advanced installation settings and test standards that allow for higher test efficiency, meeting clients’ needs. At this stage, TPW's probe card 999 Device Under Test (DUT) has entered the ranks of stable testing.
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